Defense/Aerospace

High-precision custom metal stamping for Defense/Aerospace and more

Stamping solutions for critical defense/aerospace parts

Meier manufactures high-precision metal stampings and sub-assemblies for the aerospace/defense and custom electronics industries. We excel at developing lower-cost solutions to complex and micro-sized design challenges our customers face. We support our customers with comprehensive design assistance, prototype services and manufacturing capabilities throughout the product lifecycle from concept to high-volume production.

Industry Expertise

view more

view less

Since the company was founded in 1979, Meier has worked continuously with aerospace and defense customers on a wide range of precision components, including stamped critical-to-function parts for aerospace/defense and custom electronics businesses.

Meier brings an in-depth understanding of the latest technologies to ensure on time delivery and to provide significant cost savings, allowing our clients to come in at, or under, a contract bid. We maximize our efficiency by minimizing lead time and ensuring our standards incorporate closer tolerances than other companies that focus on “realistic’” quality.

Our lean manufacturing procedures and extensive experience offer unparalleled quality micro mission-critical parts for the aerospace and defense industry and beyond. Meier’s engineering experts offer consultation on material strength and quality, meeting the exact standards for the finished product. We will analyze the prototype and CAD blueprinting to mitigate the challenges of over-specified product designs or documents. This cuts wasteful material costs and manufacturing delays throughout the product lifecycle, resulting in uncompromised precise stamped parts.

close {x}

Applications

view more

view less

Whether your requirements are simple clips or critical-to-function products with complex geometries and complicated sub-assemblies, Meier has the expertise to meet your needs. Our production and manufacturing processes can guarantee a ready-to-implement stamped sub-assembly that maintains budget and high-quality standards agreed upon at the onset of the project.

Applications

close {x}

Case Studies

view more

view less

custom-electronic-case-study-electronic-socketAutomated plastic injection over-molding

Market: Custom Electronics
Application: Electronic Socket
Material: Phosphor Bronze
Material Thickness: .014”
Complexity: Medium
Packaging: Supplied reel to reel


custom-electronic-case-study-micro-miniature-spring-contactMiniaturized component

Market: Custom Electronics
Application: Micro-miniature Spring Contact
Material: Beryllium Copper
Material Thickness: .002” Part Length .105”
Complexity: High
Secondary Operations: Gold plating for improved conductivity

 


Improved quality and part consistency

Market: Defense
Application: Fuze Component
Material: Aluminum
Material Thickness: .125”
Complexity: High
Secondary Operations: Heat Treatment and Milling

close {x}